|

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Printed circuits builded exploiting a new tecnology
were used to solve heat dissipation problems with no external
squanderer.
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Materials:
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Alluminium+Copper |
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Laminate
Thickness:
|
0,5
- 0,8 - 1,0 - 1,2 - 1,6 - 2,0 - 2,4 - 3,2 mm |
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Copper Base Thickness:
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18
- 35 - 70µm |
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Surface Finishing
:
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OSP
HAL
Chemical Gold
Electrolitic Nickel
Elettrolitic Silver
Grafite
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