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Techische Specifikationen |
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Alba Elettronica has made continuous technological investments
which have permitted to reach the best constructive characteristics
you can find in the market.
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2007
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FUTURE
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A
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Line width outer layer
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mils
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4
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3
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B
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Line
spacing outer layer |
mils
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4
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3.5
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C
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Line
width inner layer |
mils
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3
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2
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D
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Line
spacing inner layer |
mils
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3
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2
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E
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µVia
drill diameter |
mils
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--
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--
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F
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µVia
pad diameter |
mils
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--
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--
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G
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µVia
capture pad diameter |
mils
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--
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--
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H
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Drill
diameter buried vias |
mils
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12
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10
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I
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Pad
buried vias |
mils
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22
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18
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J
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Pad
diameter PTH inner layer |
mils
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22
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20
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K
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Drill
diameter PTH |
mils
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12
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10
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| L |
Pad
diameter PTH outer layer |
mils
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22
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20
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