|
|
|
|
|
|
|
Technical Specifications |
|
|
Alba Elettronica has made continuous technological investments
which have permitted to reach the best constructive characteristics
you can find in the market.
|
|
|
|
|
2007
|
FUTURE
|
|
A
|
Line width outer layer
|
mils
|
4
|
3
|
|
B
|
Line
spacing outer layer |
mils
|
4
|
3.5
|
|
C
|
Line
width inner layer |
mils
|
3
|
2
|
|
D
|
Line
spacing inner layer |
mils
|
3
|
2
|
|
E
|
µVia
drill diameter |
mils
|
--
|
--
|
|
F
|
µVia
pad diameter |
mils
|
--
|
--
|
|
G
|
µVia
capture pad diameter |
mils
|
--
|
--
|
|
H
|
Drill
diameter buried vias |
mils
|
12
|
10
|
|
I
|
Pad
buried vias |
mils
|
22
|
18
|
|
J
|
Pad
diameter PTH inner layer |
mils
|
22
|
20
|
|
K
|
Drill
diameter PTH |
mils
|
12
|
10
|
| L |
Pad
diameter PTH outer layer |
mils
|
22
|
20
|
|
|
|
|
|
|
|
|
|
